Semi-Auto Type
Wafer/Film Mounter

STM-12 STM-16

●	This equipment is to apply tape for substrate in placibis
●	Able to set applicator pressure, speed, temperature at optionally
●	Possible to DAF with change of spec

Features
○Automated applicator ○Numeric set & monitor for applicator pressure ○Numeric set & monitor for applicator speed ○Numeric monitor for vacuum	○Numeric monitor for air-pressure ○Usable various tapes included PET ○Desk-Top Type, Compact design

Specifications	STM-12	STM-16
Substrate size	Ф12”	Ф16”
Dicing flame	for max. 8”	for max. 12”
Substrate stage	whole area contact type with Teflon coated
Alignment	by visual
Temp. of stage	room temp. to 60℃
Applicator roller	variable pressure, max. 12kg/roller
Circle cutter	cutting of wafer outer or cutting of upper dicing flame
Straight line cutter	separate off with roll side
Tape separator	auto-wind roll
Dimension	850(W)x550(D)x470(H)mm	1000(W)x650(D)x470(H)mm
Weight	50kg	70kg